(Battery-Filler) (It's
also good for removing bubbles if you're using zinc and nitric acid.)
Test Jar, empty.
Test Jar, in use.
Thin copper wire.
These are the 7 test plates,
aquatinted.
This is a test-plate in the
ferric chloride.| Test Solution (each plate etched for 15 minutes) |
Time required to etch through the wire |
| 1 (full strength, 40° Baume) | 2 hrs. 9 minutes |
| 1:1 (1 pint full strength, 1 pint added water) | 7 min. 44 sec. |
| 1:2 (1 pint full strength, 2 pints added water) | 8 min. 46 sec. |
| 1:3 | 10 min. 22 sec. |
| 1:4 | 13 min. 44 sec. |
| 1:5 | 16 min. 53 sec. |
| 1:6 | 18 min. 26 sec. |
White deposits formed when etching with full strength solution.
White deposits compared to normal etch when solution is
diluted 1:1.
I didn't try etching a plate upside-down in the strong
solution
to see if there were less white deposits than when etching it face-up
as I did with the plate on the left, but I suspect that it
wouldn't make much difference in the etching action because the wire
showed the same dramatic difference in etching times between the full
strength solution and the diluted solutions as the plates did, though I
never noticed any white deposits on the wire. If it was a
gravity-related issue of something accumulating on the plate when
face-up and blocking the etchant, it seems the wire should have etched
dramatically faster than the plate in the full strength
solution.
I've also never used a vertical tank (or etched a plate
upside-down), so if using one or positioning a plate face-down fixes
the problem then it would appear to be gravity-related. I've always
gotten clean etches using diluted ferric chloride and a face-up plate,
so I've never worried about it.